A forty-five-year strategic partnership across PCs, cloud, AI, and the next generation of silicon.
Forty-five years of public statements about the Intel × IBM relationship — from financial analysts in 1982 to research leaders building sub-1nm logic in 2026. The shortlist below is what the people doing the work have actually said.
"The new High NA EUV Center at Albany NanoTech will secure a strong pipeline for semiconductor innovation, keeping New York State at the center of semiconductor expertise, accelerating the growth of the global chip industry and helping to meet manufacturing demand for new technologies such as generative AI."
"By joining forces with IBM Cloud, we are unlocking new possibilities for our mutual customers to rapidly innovate and scale their AI and hybrid cloud workloads, leveraging IBM Cloud's robust cloud infrastructure."
"Lam has been a critical partner to IBM for over a decade, contributing to key breakthroughs in logic scaling and device architecture such as nanosheet and the world's first 2nm node chip, unveiled by IBM in 2021. We are thrilled to be expanding our collaboration to tackle the next set of challenges to enable High-NA EUV lithography and sub-1nm nodes."
"As the industry enters a new era of 3D scaling, progress depends on rethinking how materials, processes, and lithography come together as a single, high-density system. We are proud to build on our successful collaboration with IBM to drive High-NA EUV dry resist and process breakthroughs, accelerating the development of lower power and higher performance transistors that will be critical for AI era."
"Time and again, Intel has taken the lead. But in a recession, the question is whether they can maintain that."
"Beyond doubt, I.B.M. is interested in Intel's technology."
"It puts no limits on our independence and ability to form technological agreements with others."
Read together, those three sentences predict the next forty-five years: Intel leads, IBM commits, the partnership preserves room for both sides to keep choosing each other. Which is exactly what happened.
"By joining forces with IBM Cloud, we are unlocking new possibilities for our mutual customers to rapidly innovate and scale their AI and hybrid cloud workloads…"
"Lam has been a critical partner to IBM for over a decade, contributing to key breakthroughs in logic scaling and device architecture…"
"As the industry enters a new era of 3D scaling, progress depends on rethinking how materials, processes, and lithography come together as a single, high-density system…"